Murugappa eyes $790 mn chip assembly facility – The New Indian Express – Bangalore

The company is in discussion for the JV. It has sought subsidy with the Ministry of Electronics and Information Technology (MeitY) for subsidy for the project under the Modified scheme for setting up of compound semiconductors / silicon photonics / sensors fab/ discrete semiconductors fab and semiconductor assembly, testing, marking and packaging (ATMP)/ outsourced semiconductor assembly and test (OSAT) facilities in India.
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