South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry’s first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) and Chip-on-Board (COB) processes within a single system
Hanmi Semiconductor strengthens ties with India amid Micron facility launch Read More »
Indian enterprises are not easing into AI; they are hard-wiring it into the core of their operations. Almost every major organisation now uses AI in customer-facing products. But this rapid adoption has exposed an uncomfortable truth. Governance frameworks have not kept pace with the speed of innovation.
How companies can embrace AI without losing control Read More »
The annual Raisina Dialogue is set to begin in the national capital region on Thursday, bringing together global leaders, policymakers and technology experts to debate the future of geopolitics, geo-economics and emerging technologies under the theme “SamskaraOrganised by the Observer Research Foundation (ORF) in partnership with India’s Ministry of External Affairs, the three-day conference from March 5 to 7 is examining how technological disruption, strategic competition and economic security are reshaping global politics.
India hosts global leaders as Raisina Dialogue 2026 focuses on AI, security Read More »
The prestigious Dr Sarabhai Award was conferred on B V Naidu, Chairman of the Karnataka Digital Economy Mission, in recognition of his contributions spanning more than three decades in innovation, skill development, policy formulation and strengthening India’s electronics system design and manufacturing ecosystem.
IESA Technovation Awards honour innovators driving India’s semiconductor ecosystem Read More »
The Ministry of Electronics and Information Technology (MeitY) has launched an indigenously developed 30 kW Wide Band Gap (WBG)-based Integrated Drive System (IDS) for electric vehicles at Indian Institute of Technology Madras, marking a key milestone in India’s power electronics and EV technology roadmap.The system has been developed by Centre for Development of Advanced Computing (C-DAC), Thiruvananthapuram, in collaboration with IIT Madras and Lucas TVS, under the National Mission on Power Electronics Technology (NaMPET) of the Ministry of Electronics and Information Technology (MeitY)
The MoU was signed by Prof. R. Thirumurugan, Registrar, CUTN, and Prof. David Menier, President, University of Southern Brittany, in the presence of Prof. M. Krishnan, Vice-Chancellor, at the CUTN campus in Thiruvarur. This MoU establishes a structured framework for academic and scientific cooperation between the two institutions over the next three years.
The inauguration of Micron’s semiconductor facility for assembly, test, marking, and packaging (ATMP) in Sanand, Gujarat, marks a tangible advance in India’s ambitions in this respect. The plant is set to commence commercial production of integrated circuit packages, modules, and solid-state drives from advanced dynamic random access memory and NAND (a storage technology) wafers.
Micron’s ATMP plant a key first step in India’s semiconductor ambitions Read More »
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