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Garg added that the Netherlands based NXP was also getting its ecosystem partners to set up operations or expand their operations in the country. For instance, Austrian firm AT&S has assembly and printed circuit board manufacturing in India.

India has kicked off its semiconductor journey, with the country, which has been heavily reliant on imports for chips, looking forward to becoming a global exporter and a key player in the industry s supply chain. India s consumption of semiconductors is expected to cross $80 billion by 2026 and $110 billion by 2030. The country is currently reliant on imports for the supply of chips but is looking forward to sharing the stage with the top leaders in the sector.

The DLI scheme aims to offer financial incentives as well as design infrastructure support across various stages of development and deployment of semiconductor design(s) for Integrated Circuits (ICs), Chipsets, System on Chips (SoCs), Systems & IP Cores and semiconductor linked design(s) over a period of five years. The DLI Scheme is implemented by CDAC.

“Fab is one big piece of the picture, but there are other pieces too. Do we have PCB or component, OSAT (outsourced assembly and testing) or ATMP (assembly, testing, marking and packaging) facilities? I think all of this has to be in order for us to be more self reliant in the sector,” Garg said. Over the last two months, semiconductor majors such as Micron, Applied Materials, AMD, and Lam Research, among others have announced their plans to expand presence in India.

“Fab is one big piece of the picture, but there are other pieces too. Do we have PCB or component, OSAT (outsourced assembly and testing) or ATMP (assembly, testing, marking and packaging) facilities? I think all of this has to be in order for us to be more self reliant in the sector,” Garg said. Over the last two months, semiconductor majors such as Micron, Applied Materials, AMD, and Lam Research, among others have announced their plans to expand presence in India.

“Fab is one big piece of the picture, but there are other pieces too. Do we have PCB or component, OSAT (outsourced assembly and testing) or ATMP (assembly, testing, marking and packaging) facilities? I think all of this has to be in order for us to be more self reliant in the sector,” Garg said. Over the last two months, semiconductor majors such as Micron, Applied Materials, AMD, and Lam Research, among others have announced their plans to expand presence in India.

“Fab is one big piece of the picture, but there are other pieces too. Do we have PCB or component, OSAT (outsourced assembly and testing) or ATMP (assembly, testing, marking and packaging) facilities? I think all of this has to be in order for us to be more self reliant in the sector,” Garg said. Over the last two months, semiconductor majors such as Micron, Applied Materials, AMD, and Lam Research, among others have announced their plans to expand presence in India.

Panellists, including Gautam Singh of Fermionic Design, Rakesh Malik of Vervesemi Microelectronics, Deepak Shapeti of Morphing Machines, Jyothis Indirabhai of Netrasemi, Narayana Rao of Accord Software & Systems, and Vinayak Dalmia of DV2JS Innovation, emphasized the importance of chip design, packaging, testing, and supply chains in driving India s semiconductor growth with strong government support.

The panel discussion on future design and investment opportunities in India steered by Shri Vinod Dham focused on supporting chip design startups to strengthen India s position in the semiconductor industry. Other participants including Shri Gautam Singh, Fermionic Design; Shri Rakesh Malik, Vervesemi Microelectronics; Shri Deepak Shapeti, Morphing Machines, Shri Jyothis Indirabhai, Netrasemi; Shri Narayana Rao, Accord Software & Systems and Shri Vinayak Dalmia, DV2JS Innovation threw light on the importance of chip design, packaging, testing, and supply chains.

The facility will expand in phases to accommodate 300 chip design engineers responsible for hightech roles. These teams will include members from top Synopsys teams such as Hardware Analytics and Test (HAT) and Hardware Development Group (HDG), including HDG Analog and HDG Design/Verification.