India has accelerated its semiconductor workforce strategy under the Chips to Startups (C2S) initiative, making significant progress toward training 85,000 semiconductor engineers as part of the India Semiconductor Mission.

Government of India’s initiative for prioritizing talent development through Training, Up-skilling and Workforce Development Programs under Chips to Startups (C2S) initiative of India Semiconductor Mission (ISM), Union Minister for Electronics and IT, Ashwini Vaishnaw, stated that India has made significant progress in last 04 years itself for its 10-year target of training 85,000 engineers in semiconductor design.

The minister highlighted the government’s push to strengthen talent development in the semiconductor sector.The programme, which is part of the India Semiconductor Mission (ISM), focuses on training, upskilling and workforce development to build a robust talent pipeline for the country’s emerging chip ecosystem. Vaishnaw said progress has already been made within the first four years of the 10-year C2S initiative.

A trade delegation from India visited the Dutch semiconductor hub of Eindhoven on ‌Wednesday to discuss investment opportunities as New Delhi accelerates its efforts to build a domestic chip industry.

South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry’s first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) and Chip-on-Board (COB) processes within a single system